Placement, reflow and inspection
Align BOM, placement data, component orientation and the soldering route before the build. Define first article checks and the inspection needed for visible and hidden solder joints.
Connect printing, placement, reflow and inspection to the component mix and board design. Review where solder paste inspection, optical checks or X-ray inspection support the agreed acceptance plan.
First-article review example · Use these fields to define the requested review. Example entries are illustrative; the order confirms the accepted scope and records.
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| First-article field | Your released input | Example disposition before continuation |
|---|---|---|
| Reference / package | BOM MPN, land pattern and placement reference | Verify the same device and footprint; resolve any mismatch. |
| Rotation / polarity | Centroid convention and assembly drawing | Record the affected RefDes and image / observation; customer approves correction. |
| Release status | BOM, placement and drawing revision | Accepted / awaiting decision; link the approved response to the revised file set. |
An SMT build depends on the fit between component packages, PCB land patterns, solder paste and the thermal process. KeepBest reviews these inputs with your BOM and placement files to plan the assembly route. For prototype, NPI or repeat orders, define inspection needs and special handling requirements before the design reaches the production line.
Review stencil features, board support, rotations and component identity together.
Review aperture design, land patterns and paste requirements against the actual component packages. Fiducials, panel support and access around dense areas influence how the board is prepared for printing and placement.
Match reference designators, rotations and package information between the BOM and pick-and-place file. Identify polarity, unusual components and customer-specified handling instructions before the placement program and first article are reviewed.
The assembly sequence and checks follow the actual materials and package risks.
Assess the temperature limits of components, laminate and finish alongside the soldering requirements. Double-sided assemblies and thermally sensitive devices need a reviewed sequence rather than an assumed standard thermal process.
Use the inspection plan to address paste printing, component presence, orientation and solder workmanship. Hidden-joint packages may need an additional X-ray review, with criteria defined for the specific design.
Identify components that require controlled storage or handling using their packaging and manufacturer information. Agree incoming condition, exposure history and preparation requirements so the build starts with suitable material.
Inputs, decisions & outputs
Compare the BOM, board data and placement information for package, reference and orientation differences. Confirm do-not-fit components and sensitive areas before assembly preparation uses the released manufacturing data.
Review stencil, paste, fiducials, panel support and component presentation for the design. The first article review uses these agreed inputs to identify issues before the intended build proceeds.
Assess the populated sides and component temperature constraints against the selected process. Any exceptions, special handling or changes to the approved design return to engineering and the customer for confirmation.
Apply the agreed paste, optical and additional inspection checks at the appropriate stages. Programming and functional testing follow their own approved specifications, with disposition recorded for units that need further review.
Your project
Select the items you want to carry into the project brief.
Before release
Provide the exact part numbers, package details and board files for feasibility and inspection review. The package geometry and hidden joints determine the assembly and inspection requirements that engineering needs to confirm.
Provide pick-and-place data and an assembly drawing with polarity and orientation references. Package libraries and coordinate conventions can differ, so first article review should confirm the intended physical orientation on the board.
AOI reviews visible assembly features. Hidden connections under packages may need X-ray or another agreed method. Neither visual method replaces an electrical or functional test required by the product acceptance specification.
The process sequence must consider component retention, thermal exposure, support and any later through-hole operations. Mark both populated sides and relevant part restrictions so engineering can review the complete route.
Yes, a mixed technology route can combine SMT and THT. Provide insertion and soldering requirements for the through-hole components so their processing and inspection fit the completed SMT assembly.
Connected resources
Placement, reflow and inspection
Tell us what you are building and what you need reviewed. Include the current revision, quantities and any open questions. The project scope and acceptance criteria are agreed from your requirements.
Submit your details and files for project review. A saved reference confirms receipt; notification delivery is tracked separately.
Fill in your requirement information and upload Gerber and BOM files, we will give you a quote within 24 hours.
Fill in your requirement information and upload Gerber and BOM files, we will give you a quote within 24 hours.
