Electronic Manufacturing Equipment & Machinery

Leading the way for over 12+ years

Machinery and equipment

A list of our major pieces of equipment includes:

Production and processing of SMT components such as resistors, capacitors, inductors, diodes,0402,0603, 0805, 1206 and other specifications and sizes; transistors, etc.: 03015, 01005, 0201
IC: Support SOP, TSOP, TSSOP, QFN and other packages, minimum pitch 0.3mm;Support BGA, CSP packaging, minimum ball diameter (Ball) 0.2mm;
Printing size: 50mm x 50mm ~ 370×470mm;
PCB specifications: thickness 0.4mm ~ 6mm

supports from ultra-tiny chips of 0201mm to large-size components of 55 x 100 mm and height of 15 mm.
handles a broad spectrum of components from ultra-tiny chips of 03015mm, to ultra-large components of 55 x 100 mm and tall components of heights to 28 mm.
Improving mounter operation from component pickup to mounting and using high-speed XY axes achieved production of 95,000 CPH which is 5% higher than conventional models.
support high speed mounting of components down to only □8 mm to □12 mm in size. Also, use of side lighting gives high-speed recognition of ball electrode components such as CSP (chip scale packages) and BGA (ball grid arrays).

supports from ultra-tiny chips of 0201mm to large-size components of 55 x 100 mm and height of 15 mm.
handles a broad spectrum of components from ultra-tiny chips of 03015mm, to ultra-large components of 55 x 100 mm and tall components of heights to 28 mm.
Improving mounter operation from component pickup to mounting and using high-speed XY axes achieved production of 95,000 CPH which is 5% higher than conventional models.
support high speed mounting of components down to only □8 mm to □12 mm in size. Also, use of side lighting gives high-speed recognition of ball electrode components such as CSP (chip scale packages) and BGA (ball grid arrays).