PCB Assembly Equipment
A list of our major pieces of equipment includes:
GKG Fully Automatic Solder Paste Printer-G9+
- Production and processing of SMT components such as resistors, capacitors, inductors, diodes,0402,0603, 0805, 1206 and other specifications and sizes; transistors, etc.: 03015, 01005, 0201
- IC: Support SOP, TSOP, TSSOP, QFN and other packages, minimum pitch 0.3mm;Support BGA, CSP packaging, minimum ball diameter (Ball) 0.2mm;
- Printing size: 50mm x 50mm ~ 370×470mm;
- PCB specifications: thickness 0.4mm ~ 6mm
YAMAHA YSM20R
- supports from ultra-tiny chips of 0201mm to large-size components of 55 x 100 mm and height of 15 mm.
- handles a broad spectrum of components from ultra-tiny chips of 03015mm, to ultra-large components of 55 x 100 mm and tall components of heights to 28 mm.
- Improving mounter operation from component pickup to mounting and using high-speed XY axes achieved production of 95,000 CPH which is 5% higher than conventional models.
- support high speed mounting of components down to only □8 mm to □12 mm in size. Also, use of side lighting gives high-speed recognition of ball electrode components such as CSP (chip scale packages) and BGA (ball grid arrays).
3D-SPI Automatic solder paste testing machine
- Imaging speed when equipped with a Z axis. The XL size comes standard with a Z axis.
- For dual mode, the PCB Clearance Bottom is 50mm (1.96 in.).
- For dual mode, the PCB Size is 50×60〜320×510 (1.97 x 2.36 – 12.60 x 20.07)
- 4 An expansion to 60 inches (686 x 1524) is optional.
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Automatic loading machine
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PCB cleaning machine
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G9+Automatic solder paste printing machine
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3D-SPI Automatic solder paste testing machine
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Yamaha YSM20R chip mounter
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Yamaha YS24 chip mounter
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Yamaha YSM10 chip mounter
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Ten temperature-controlled zone nitrogen reflux furnace
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AOI
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